PCB Assembly 生产能力 订购数量 1-50,000pcs(含样品) 零件 SMD and THT
From size 0402.0201 to 01005
SOIC,PLCC,TSOP,QFP,BGA装件方式 Single and double-sided/SMD and THT/SMT and Thru-hole 球形矩阵(BGA) As small as 0.5mm pitch
All BGA placements are inspected by X-Ray组件包 Poles,Reels,Tape Strips,Bulk Supply 零件尺寸范围 55*55*15mm
Fine Pitch from 0.4mm
Minimum Pin width 0.2mm焊接 Lead free and conforming to DIN 32513,ISO,EN29454,IPC 650 测试方式 Aol & X-Ray Inspection,Flying Probe Test and in Circuit Test 文件格式 BOM & Gerber files